Yeah, the problem with cutting edge devices that strive to be thiner and thiner is that you have to pick the package at design time. You can't usually footprint multiple parts onto the PCB and then use whatever is available at production time because there just isnt enough space. Its usually easy to say "why didnt they use this part?" and pick some obscure new part. But in reality if that part isnt in mass production, making millions of units of the phone could get very very expensive.
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