paponando

Does anybody out there know what each individual component is and does inside my DINC2 are? Im talking about a disection piece by piece of the inside of the phone. I am determined to find out why my phone killed over, even if i have to disect it piece by piece! I'll say it was for educational purposes.

paponando

Does anybody at least know where i can go to obtain this information?

acejavelin

Design level details are not available for just about any device, much less schematics and detailed chipset designations... Best bet would be a strong magnifying glass and Google unfortunately, most of the components are probably available "off the shelf" (albeit in quantities of 1000's) but I am sure you will find plenty of proprietary components as well that no information will be available about.

paponando

How difficult do you think it would be to try to come up with some sort of component schematic? And would i get in trouble for attempting it?

valorian

Yes, you can get into trouble as the information you are trying to obtain is proprietary. What you are trying to do is called Reverse Engineering.

As acejavelin mentioned, some of the information can be found on the internet. Most chip manufacturers have information on their website you can view on all the chips they make.

But, to try to create a schematic is very difficult at best. I was a Electronics Lab Tech for 6 years and assisted in some reverse engineering projects.

Even IF you were able to create some sort of schematic you would need specialized test equipment to determine which component failed if the failure was hardware related.

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